Custom Rack Mount Card Cages

EEi Designs and Manufacturers Custom Card Cages Systems with Forced Air Cooling for Production Applications.

Many card cage suppliers followed published standards by IEEE, VITA, PICMG, etc. The intent was to have a modular approach using multiple machined extrusions, lots of injection molded plastic parts, stampings, and a lot of careful assemble labor. A typical 19” rack mount system could easily be over 300 parts to produce a card cage frame with the desired HP and plug-in card to backplane/center-plane alignment. Each part across the width of the assembly adds its own tolerance error. All these tolerances added together introduced another critical problem. Plug-in card to backplane alignment (think connector pin damage). This led to an alignment procedure using plug-in cards to help align the backplane or center-plane before it’s secured to the card cage frame. This method still has numerous tolerances that stacked up in the process; but generally, it’s been “good enough.” Overall alignment became even more imprecise if the card cage support RTM slots.
Wait, there’s more. The use of plastic card guides generates ESD problem on the board while they are being inserted into the card cage. An approach to discharging the ESD before it could impact the backplane was devised and more parts were added along with a board design requirement.

A New Approach to Producing Card Cages

Any Card, Any Pitch, Any Size, Any Bus (Standard or Custom)

After four decades from when these standards were first published, Don Goss, President & CTO at EEi knew it was time for a fresh look. While maintaining the general requirements of the standards, his new approach reduced the part count from as much or more than 300 parts to 6 plus some fasteners. Precision increased and backplane or center-plane alignment is now instantaneous precise. The decades of using plug-in cards for backplane alignment are over. Wait, there’s another benefits. Our methods are not restrained by the .200” (5.08mm) “HP” pitch set in various standards. If the design of your plug-in cards needs a nonstandard pitch like .775” or 1.175” or anything else, we can produce exactly what you need. We are not limited to standard depth cards (100mm, 160mm, 220mm, etc.) or 3U, 6U, 9U, etc., board heights either. Once engineered into our card cage manufacturing process, you get exactly what you require.
Wait, one more thing! If you adopt our backplane or center-plane instantaneous alignment method, the backplane to card guide alignment can’t get any better, its amazingly precise. We provide some addition features that need to be added to the bottom and/or top near the backplane’s attachment screw holes, well away from the bus. Typical screw slots to allow for backplane lateral alignment adjustment can now just be plain drilled holes rather than routed slots.

Redundant Hot-Swap Power

Many of the bus standards typically use a power supply that plugs directly into the backplane, usually via a Positronic® connector. Fine, no problem unless you need more power than what’s available for those type supplies. You can go to N+1 and lose slot space if you can afford to. Because of our design and manufacturing flexibility, we have many more options than what’s presented in the bus standards by IEEE, PICMG, etc. Maybe you need redundant hot-swap 3,000watt supplies. There are options for that and anything down to 250watts. Some options don’t require slots space giving you more width for additional plug-in modules.

Single or Multiple Fans as FRUs

With fans as FRUs, a single or multi-fan tray can be replaced in fewer than 30 seconds, should a fan fail. Card cage fan trays can be made as a hot-swap FRU. We employ fans based on multiple performance criteria and coverage across the card cage.

With a vertically aligned card cage, adding fan driven active cooling generally adds 2U to the height of the card cage frame itself. Air is pulled in from the front (datacenter’s cool aisle), the fans force the cool air through the cards. The heated exhaust air exits through the top of the card cage exits out the rear (datacenter’s hot aisle). Temperature signal outputs from micros on plug-in cards can be used to control PWM fans or we can add one or more thermistors in the exit zone above the card cage to control PWM fans.

For a horizontally oriented card age, a fan tray can be on either end. This may restrict the height of your card to a standard 6U or up to ~14” (356mm) for a custom board height.

In some system where watt dissipation if quite high, like ATCA systems, multiple cooling techniques may be needed. Vapor Chambers to spread a BGA’s heat across a larger than normal heatsinks. Using dual fan trays with one pushing cool air into the card cage and a second, on the far side, pulling hot air through the card cage.

Precision and flexibility are the new keys to production rack mount card cages for any alternative board configurations, thermal considerations, and card cage requirements.